1. 2. 3. material content data sheet sales product name idv08e65d2 issued 29. august 2013 ma# MA000997630 package pg-to220-2-22 weight* 2175.58 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.330 0.02 0.02 152 152 leadframe non noble metal iron 7439-89-6 1.053 0.05 484 inorganic material phosphorus 7723-14-0 0.316 0.01 145 non noble metal copper 7440-50-8 1051.163 48.33 48.39 483165 483794 wire non noble metal aluminium 7429-90-5 1.283 0.06 0.06 590 590 encapsulation organic material carbon black 1333-86-4 2.229 0.10 1025 plastics epoxy resin - 209.516 9.63 96303 inorganic material silicondioxide 60676-86-0 902.702 41.49 51.22 414924 512252 leadfinish non noble metal tin 7440-31-5 5.465 0.25 0.25 2512 2512 plating non noble metal nickel 7440-02-0 1.114 0.05 512 inorganic material phosphorus 7723-14-0 0.003 0.00 0.05 1 513 solder non noble metal antimony 7440-36-0 0.041 0.00 19 noble metal silver 7440-22-4 0.101 0.00 47 non noble metal tin 7440-31-5 0.263 0.01 0.01 121 187 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
